Tuesday, 22 September 2015 11:32

Meet Cyprain Emeka Uzoh, Nigerian with over 160 world patents

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Cyprian Emeka UzohCyprian Emeka Uzoh is a genius from Nigeria who holds more than 126 United States issued patents and over 160 patents worldwide in semiconductor technology. He also co-authored more than 35 publications.

In 2006, he was celebrated as Inventor of the Year for the patent "Method of making electroplated interconnection structures on integrated circuit chip" (USPTO 6,709,562), one of the most valuable patents in the field of semiconductor science and technology. He is the main pioneer of modern high performance copper interconnect technologies and has discovered, co-developed and co-implemented the various critical elements and technologies that led to the successful implementation of copper interconnect technology at IBM Corporation, as well as in the entire semiconductor industry.

In other words, this technology enabled the introduction of copper in the making of chips, and it was revolutionary. Cyprian Emeka Uzoh, more than anybody else, was responsible for the discovery of the electroplating technology in this industry.
IBM put this technology into production in the late 1990s and is now the main device wiring method that uses electric field and metal slurries to polish metals at low forces.

IBM put this technology into production in the late 1990s and is now the main device wiring method that uses electric field and metal slurries to polish metals at low forces.

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Cyprian Emeka Uzoh

 

Summary of Cyprian Emeka Uzoh's Achievements :

"2006 Inventor of the Year” – For the patent “Method of making electroplated interconnection structures on integrated circuit chip” (USPTO 6,709,562), one of the most valuable patents in the field of semiconductor science and technology.

Holds more than 126 United States issued patents and over 160 patents worldwide in semiconductor technology and co-authored more than 35 publications.

Principal pioneer of modern high performance copper interconnect technologies. Seminal discoveries and inventions are the core backbone of high performance chip interconnects technology. Discovered, co-developed and co-implemented the various critical elements and technologies that led to the successful implementation of copper interconnect technology at IBM Corporation and the entire semiconductor industry.

Pioneered void-free damascene metal gap fill technology, closed loop bath management processes, high performance redundant barrier structures (TaN/Ta, hexagonal TaN/Ta, families of graded composition barrier films), reliable copper integration processes and structures, modern and advanced plating cell designs, highly reliable continuous crystalline interconnects and non-contact testing of wiring structures.

First person to demonstrate void-free damascene copper and to improve copper electromigration from 0.7eV to 1.2eV.

Invented electro-chemical mechanical planarization (eCMP) technology – a comparatively inexpensive method of polishing metals with electric fields using metal slurries at low pressures.

Specialties:

Notable specialty in the stability of thin film interfaces, thin film microstructure/defects, thin film reliability, high performance materials/structures, advanced process integration, yield management processes, low cost and high yield processes, electrodeposition, 3D structures and equipment design.

Experiences:

1. Principal Technologist at Tessera, October 2010 to date.
2. Research Fellow at SoloPower, Inc. between October 2007 and March 2011.
3. ASM Fellow at ASM-NuTool, Inc. from 2005 to June 2007.
4. Vice President of Research, Process and Technology at NuTool, Inc. between 2001 and June 2007.
5. Director of Technology at NuTool, Inc. from March 1999 to June 2001.
6. Scientist/Advisory Engineer at IBM Corp. T. J Watson Research Center from June 1985 to February 1999.

Education:

1. Christ the King College (CKC), Onitsha,Nigeria
2. Rensselaer Polytechnic Institute (Materials Science and Engineering)
3. University of Wisconsin-Madison (Metallurgical Engineering)

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